During the sputtering process, backing plate serves is used to strengthen sputtering targets and conduct heat. The bonding ratio of backing plate and sputtering target will directly affect the sputtering process and the quality of thin film, and may even affect the product lifetime of sputtering target.
For targets made from different materials and in different shapes, SOLAR can provide the most suitable bonding process to fit clients’ sputtering process or sputter.
For targets made from different materials and in different shapes, SOLAR can provide the most suitable bonding process to fit clients’ sputtering process or sputter.
- Targets come in planar, rotary or special-shaped.
- Backing plate materials include copper, titanium and molybdenum.