
- In the semiconductor field, we provide equipment consumables specifically for four major processes – Electrochemical Deposition (ECD), Dry Etching, Ion Implanting and Physical Vapor Deposition (PVD).
- Our materials types from silicon, quartz, ceramic to other metal materials, such as gold, silver, platinum, palladium, tantalum, titanium, aluminum, copper, nickel, SUS and PEEK.
- Spare parts can be customized according to client requirements.
Equipment | List of Parts |
---|---|
ECD | 1. Probe POT Potentiostatic Copper (Cu) 2. POT Cable Kit (Cu) 2. Titanium Fastener 3. Wafer Contact Ring |
Etching | 1. Insert Ring, Si Ring 2. RF Gasket |
Ion Implanter | 1. Ta Parts 2. Ag Parts 3. NiFe Parts 4. PEEK Insert Ring 5. Graphite Parts |
PVD | 1. Ta Coil 2. SUS Clamp |