Semiconductor Packaging and Testing
Probe Materials
Probe materials are applied in wafer testing, packaging testing, PCB testing and LED testing.
- Probe brings out electrical signal from chip by being in direct contact with the bonding pad or bump on the chip. Coupled with testing equipment and software control to achieve automatic measurement.
- Probe is used to screen out defective products prior to production. Therefore, in the production of electronic components, it is one of the important processes that has a considerable impact on manufacturing costs.
- Probe materials can be supplied to:
(1) Probe card: Cantilever probes, cobra probes, wire probes, etc.;
(2) Socket: Micro-spring probes;
(3) LED testing: LED contact probes.
- Properties of probe materials:
(1) High hardness that can withstand millions of repeated tests;
(2) High elasticity that can stable contact with the electrode holder;
(3) Antioxidant activity that can avoid contamination of the test object;
(4) Low resistance and high electrical conductivity applicable for high current inspection.
Products can be shipped in coils or bars according to customer requirements.
| Product Type | PA Series | PB Series | PH Series | PK Series |
| Wire Diameter (mm) | 0.015 ~ 8.000 | |||
| Resistivity(µΩ.cm) | 10 ~ 15 | 27 ~ 37 | 9 ~ 11 | 6 ~ 7 |
| Hardness of Heat-treated Materials (Hv) | 380~500 | 360~450 | 380~550 | 380~500 |
| Copper-Silver Alloy Series | |
|---|---|
| Product Type | CA Series |
| Wire Diameter (mm) | 0.015 ~ 8.000 |
| Resistivity (µΩ.cm) | 2 ~ 3 |
| Hardness of Heat-treated Materials (Hv) | 260 ~ 350 |
